Adhesives, Epoxies, Greases, Pastes
Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
H-PUTTY2-100015
$424.5743
Shiu Li Technology Co., Ltd.
65-00-CIP35-0200In Stock
$135.1612
Parker Chomerics
TC-GC-04-CIn Stock
$8.2127
Sfera Labs
H-PUTTY2-100216
$57.3073
Shiu Li Technology Co., Ltd.
D2000-140-KIT5
$150.4064
Shiu Li Technology Co., Ltd.
2711510In Stock
$146.9442
Bergquist
TG-NSP25-60In Stock
Real-time quotes
t-Global Technology
153-Q-NCIn Stock
$95.7514
Wakefield-Vette
156-K-NCIn Stock
$60.998
Wakefield-Vette
21-430SF-001-010M10
$10.5148
Jones Tech
S-PUTTY2-98515
$391.1495
Shiu Li Technology Co., Ltd.
TIC4000-00-00-0.5CCIn Stock
$38.4688
Bergquist
21-440-001-030M10
$13.5691
Jones Tech
21-340B-001-300M10
$68.8727
Jones Tech
PROHMPROTECT-3500-1.5100
$12.0181
ProhmTect
65-00-GEL30-030082
$216.8865
Parker Chomerics
TH855-5-50G-2JAR4
$33.9405
Penchem Technologies Sdn Bhd
P0200-209
$26.044
Littelfuse Inc.
TH930-50G-2JAR4
Real-time quotes
Penchem Technologies Sdn Bhd
TT3000-15027
$125.9024
Shiu Li Technology Co., Ltd.
- 1
- 2
- 3
- 4
- 5
- 6
- 29
SUBSCRIBE
Subscribe to receive our offers