Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
TH855-5-50G-4JAR2
$74.9952
Penchem Technologies Sdn Bhd
TH930-500G-JARIn Stock
Real-time quotes
Penchem Technologies Sdn Bhd
TH930-50G-2JAR4
Real-time quotes
Penchem Technologies Sdn Bhd
TH235-2-50G-4JAR1
$64.56
Penchem Technologies Sdn Bhd
TH235-2-500G-JAR10
$78.8758
Penchem Technologies Sdn Bhd
TH235-2-50G-2JAR3
$30.828
Penchem Technologies Sdn Bhd
TH855-5-30G-4SYR4
$114.0624
Penchem Technologies Sdn Bhd
TH855-5-500G-JAR6
$92.3758
Penchem Technologies Sdn Bhd
TH235-2-30G-2SYR5
$46.6499
Penchem Technologies Sdn Bhd
TH235-2-30G-4SYR5
$93.6391
Penchem Technologies Sdn Bhd
TH855-5-50G-2JAR4
$33.9405
Penchem Technologies Sdn Bhd
1978-128
$61.725
Techspray
1978-DP51
$31.5598
Techspray
CW7250In Stock
$17.5812
Chemtronics
CT40-5PIn Stock
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Chemtronics
CW727067
$11.2724
Chemtronics
9E133030CC14
$16.3291
ELBA LUBES
103800F00000G62
$23.3639
Aavid, Thermal Division of Boyd Corporation
9460TC-3ML48
$14.4503
MG Chemicals
103700F00000GIn Stock
$31.1776
Aavid, Thermal Division of Boyd Corporation
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